Dk-760D Silicon Wafer Wire Cutting Fluid

Silicon wafer wire cutting fluid DK-760D is used for diamond wire cutting of semiconductor materials like monocrystalline silicon, polycrystalline silicon, wafers, and ceramics. It is formulated with surfactants, lubricants, EP additives, and other auxiliaries, making it an environmentally friendly, fully synthetic wire cutting fluid.

Dk-760C6 Water-Soluble Grinding Fluid

Dremfu DK-760C6 water-soluble grinding fluid is prepared by a variety of surfactants, lubricants, anti-rust agents and other additives. It is suitable for wire-cut cooling processing of glass-ceramics, quartz, optical glass and other materials.

Dk-760N Water-Soluble Cutting Fluid

Dremfu inner circle cutting fluid DK-600 is made of surfactants, lubricants, anti-rust agents and other additives under strict production process control. It is suitable for the inner circle cutting of glass, sapphire glass and crystal of various materials. This product is easy to use, when in use, the active ingredient should be kept above 5%, that is, diluted by 1:20 (coolant: water, wt/wt), and can be used after mixing evenly. Due to different processing conditions, if there is loss or loss during use, the stock liquid and water should be added proportionally.

DK-600 Inner Circle Cutting Fluid

DK-600 internal cutting fluid is a cutting fluid refined from surfactants, lubricants, anti-corrosion agents and other additives. It is designed for internal cutting applications of various materials, especially for precision machining of hard materials such as glass, sapphire glass and crystal. This type of cutting fluid has strong lubricity and cooling performance, effectively prolongs the service life of the tool, improves machining accuracy, and maintains good workpiece surface quality during machining.

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Products

Dk-760D Silicon Wafer Wire Cutting Fluid

Dk-760C6 Water-Soluble Grinding Fluid

Dk-760N Water-Soluble Cutting Fluid

DK-600 Inner Circle Cutting Fluid

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