Wafer Cutting Fluid

Dk-760M Silicon Wafer Cutting Fluid

Silicon wafer cutting fluid DK-760M is suitable for various machining processes of semiconductor materials such as monocrystalline silicon, polycrystalline silicon, wafers, and ceramics, including milling, rolling, coarse grinding, fine grinding, edge grinding, and chamfering. It offers strong lubrication and cleaning penetration, effectively enhancing processing efficiency and being a reliable aid in your machining operations.

Dk-760D Silicon Wafer Wire Cutting Fluid

Silicon wafer wire cutting fluid DK-760D is used for diamond wire cutting of semiconductor materials like monocrystalline silicon, polycrystalline silicon, wafers, and ceramics. It is formulated with surfactants, lubricants, EP additives, and other auxiliaries, making it an environmentally friendly, fully synthetic wire cutting fluid.