Dk-760D Silicon Wafer Wire Cutting Fluid

【Performance and use】

Silicon wafer wire Cutting Fluid DK-760D is used for diamond wire cutting of semiconductor materials like monocrystalline silicon, polycrystalline silicon, wafers, and ceramics. It is formulated with surfactants, lubricants, EP additives, and other auxiliaries, making it an environmentally friendly, fully synthetic wire Cutting Fluid.

【Main technical parameters】

【Product advantage】

1. not corrupt, long service life.

The anti-corrosion property of Silicon Wafer Wire Cutting Fluid is one of its key features, protecting cutting equipment and tools from corrosion while avoiding damage to the surface of the silicon wafer. It usually contains anti-corrosion additives to extend the service life of equipment and tools, ensure the stability of the liquid during the cutting process, and maintain the high quality of the silicon wafer. This anti-corrosion function is a key factor in ensuring that the precision cutting process is efficient and damage-free.

2. Good rust resistance, no irritation to the skin.

The rust resistance of Silicon Wafer Wire Cutting Fluid is one of its key features. By adding rust inhibitors, metal parts are effectively protected and cutting equipment and tools are prevented from rusting. This rust resistance not only extends the service life of the equipment, but also ensures the stability and cutting quality of the equipment during the cutting process, avoiding rust particles from contaminating the silicon wafer, thereby improving production efficiency and product accuracy.

3. Excellent powder sedimentation, the use of powder will not block the steel wire.

4. Excellent lubricity, cooling, cleaning, strong adhesion, good processing performance.

Lubricity:

Cutting fluid provides good lubrication, reduces friction between cutting tools and silicon wafers, and reduces tool wear. It helps the cutting line run smoothly, reduces heat generated by friction, prevents damage to equipment and silicon wafers, and improves cutting accuracy.

Cooling:

During the silicon wafer cutting process, the heat generated by cutting may cause the silicon wafer to crack or deform. The cutting fluid has excellent cooling performance, effectively absorbs and dissipates the heat generated during the cutting process, ensures that the cutting temperature remains in a stable range, and avoids overheating and damage to the material.

【Instruction】

1.The working liquid is diluted with 10-20 times tap water or deionized water.

2.In the course of use, the clean working liquid can be replenished at a concentration of 3-5%.

3.Avoid mixing with other oils.

【Packaging】

18L/ barrel, 25L/ barrel, 200L/ barrel.

Silicon wafer wire cutting fluid DK-760D.pdf

【Note】

1. This product should not be mixed with other emulsions, semi-synthetic liquids, and fully synthetic liquids, because even if the system contains a small amount of rotten residual liquid, it will affect the use effect of the new liquid.

2. the production batch is not the same, the cutting fluid may have color differences, does not affect the normal use.

Silicon Wafer Wire Cutting Fluid is used in the manufacture of optical devices to ensure high precision and high-quality surfaces during precision cutting by providing cooling, lubrication and reducing friction. It helps reduce the heat generated during cutting, prevents material deformation or damage, extends the life of cutting tools, and improves production efficiency. These functions make it play a key role in the processing of high-precision optical components such as optical silicon wafers, lenses, lasers, etc.

Silicon Wafer Wire Cutting Fluid is used in the manufacture of micro-electromechanical systems (MEMS), mainly to ensure high precision and high quality of the cutting process by providing cooling, lubrication and reducing friction. It effectively dissipates heat, prevents deformation or damage of tiny structures, reduces tool wear and prolongs service life, while removing particles generated during the cutting process to avoid contamination of the surface of MEMS devices. These characteristics make it play a key role in MEMS manufacturing, ensuring precision cutting and equipment stability.