Dk-760M Silicon Wafer Cutting Fluid

【Performance and use】

Silicon wafer Cutting Fluid DK-760M is suitable for various machining processes of semiconductor materials such as monocrystalline silicon, polycrystalline silicon, wafers, and ceramics, including milling, rolling, coarse grinding, fine grinding, edge grinding, and chamfering. It offers strong lubrication and cleaning penetration, effectively enhancing processing efficiency and being a reliable aid in your machining operations.

【Main technical parameters】

【Product advantage】

1.has high grinding speed, excellent lubricity and self-sharpening performance.

2.Excellent wettability and cleaning, powder can quickly settle.

3.No odor, no foam, no corrosion machine.

【Instruction】

1.  The working liquid is diluted with 10-20 times tap water or deionized water.

2. In the course of use, the clean working liquid can be replenished at a concentration of 3-5%.

3. Avoid mixing with other oils.

【Packaging】

18L/ barrel, 25L/ barrel, 200L/ barrel.

Silicon wafer cutting fluid DK-760M.pdf

【Note】

1. This product should not be mixed with other emulsions, semi-synthetic liquids, and fully synthetic liquids, because even if the system contains a small amount of rotten residual liquid, it will affect the use effect of the new liquid.

2.the production batch is not the same, the Cutting Fluid may have color differences, does not affect the normal use.

Silicon Wafer Cutting Fluid is essential in semiconductor manufacturing, and is mainly used to provide cooling, lubrication, and prevent material damage during the silicon wafer cutting process.

Reduce friction and heat during cutting:

In semiconductor manufacturing, a large amount of heat is generated when silicon wafers are cut, which can easily cause cracks or deformation of silicon wafers. Silicon Wafer Cutting Fluid can effectively reduce friction, reduce heat accumulation, ensure stable cutting temperature, and prevent silicon wafer damage.

Improve cutting accuracy:

Semiconductor silicon wafer cutting requires high precision and flawlessness. Cutting fluid helps cutting tools cut into materials more smoothly through lubrication, reduces surface defects and cutting deviations, thereby improving cutting accuracy and quality.

Extend the service life of cutting tools:

When cutting silicon wafers, cutting tools such as diamond saw blades are subject to greater friction and wear. Silicon Wafer Cutting Fluid reduces tool wear through lubrication and cooling, extends its service life, and reduces production costs.

Prevent silicon wafer cracks and fragments:

During the cutting process, silicon wafers are prone to uneven stress, causing cracks or fragments. Cutting fluid helps maintain the integrity of silicon wafers and avoid unnecessary losses by reducing temperature fluctuations and physical shock during the cutting process.

Optimize waste management:

Cutting fluid can also help remove waste and tiny particles generated during the cutting process, keep the work area clean, ensure that the surface of the silicon wafer is not contaminated, and reduce quality problems caused by contamination.

The application of Silicon Wafer Cutting Fluid in the solar industry is mainly reflected in the silicon wafer cutting process. It can effectively reduce friction and temperature during cutting, prevent cracks and damage to silicon wafers, and ensure cutting accuracy and surface smoothness. At the same time, cutting fluid can also extend the service life of cutting tools, improve production efficiency, and ensure the quality and reliability of solar cells.

Silicon Wafer Cutting Fluid is used in precision machining, mainly for cutting hard materials such as ceramics, quartz, etc. By providing cooling and lubrication, reducing friction and heat, ensuring high precision during the cutting process, preventing excessive tool wear, while improving cutting quality and extending tool life.